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Added stm32g474 and Amphenol BergStak connectors

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master
Kerem Yollu 2 years ago
parent 2c9546d1b0
commit 454704bc06
5 changed files with 28387 additions and 68 deletions
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124
footprints/811_connector_board_to_board.pretty/amphenol_BergStak_header_2Rows-50Pins_0.4mm_1.5mmStack-Height.kicad_mod
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@ -0,0 +1,124 @@
(footprint "amphenol_BergStak_header_2Rows-50Pins_0.4mm_1.5mmStack-Height" (version 20221018) (generator pcbnew)
(layer "F.Cu")
(clearance 0.08)
(attr smd)
(fp_text reference "REF**" (at -17.6 -0.2 90) (layer "F.SilkS") hide
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 8bdb4081-d0cb-4bc7-b525-7d5ae3a0d185)
)
(fp_text value "amphenol_BergStak_header_2Rows-50Pins_0.4mm_1.5mmStack-Height" (at 0 5.6) (layer "F.Fab") hide
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 61b36eee-8fb1-4c0a-aa50-8dc9552dff40)
)
(fp_rect (start -6.01 -1.935) (end 6.01 1.935)
(stroke (width 0.1) (type default)) (fill none) (layer "F.SilkS") (tstamp c72982b9-ab39-49bd-9ec0-66d2f9121f30))
(fp_circle (center -5.5 1.4) (end -5.3 1.4)
(stroke (width 0.1) (type solid)) (fill solid) (layer "F.SilkS") (tstamp aebbadb9-85f4-4528-8856-e2906134e665))
(fp_rect (start -5.81 -1.735) (end 5.81 1.735)
(stroke (width 0.1) (type default)) (fill none) (layer "F.CrtYd") (tstamp 46e78805-8d2e-44af-8fb1-6ad5f3da17ed))
(pad "1" smd rect (at -4.8 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp f351d3be-a4b1-4400-824d-44c652a18c7c))
(pad "2" smd rect (at -4.8 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 2f111214-ecd2-4e92-a513-6f414e58d9e1))
(pad "3" smd rect (at -4.4 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 762834b2-22d1-4438-8e5a-9d161ba51489))
(pad "4" smd rect (at -4.4 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp c1956b9e-0c7f-4b2f-884d-28a276332690))
(pad "5" smd rect (at -4 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp cf4bc76c-6814-4d19-8afb-f1d4044290ba))
(pad "6" smd rect (at -4 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 3bcac6b4-ad44-4c8a-8200-87f6b9b0a6b1))
(pad "7" smd rect (at -3.6 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 6c63062e-9bb8-4186-ac00-bdcccc1977e9))
(pad "8" smd rect (at -3.6 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 579be023-d295-4911-a0c8-0641ff9c110a))
(pad "9" smd rect (at -3.2 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 7129ab5d-e9e5-463c-bad3-01a6227b6452))
(pad "10" smd rect (at -3.2 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp f919ebf3-7484-4d59-80ef-13a9b64d142f))
(pad "11" smd rect (at -2.8 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp f2ec2982-38a9-4b5c-b956-a37659e882bc))
(pad "12" smd rect (at -2.8 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "13" smd rect (at -2.4 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "14" smd rect (at -2.4 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(thermal_bridge_angle 45) (tstamp 6e716aec-bc39-4ffd-a52c-43ea548db548))
(pad "16" smd rect (at -2 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "17" smd rect (at -1.6 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "19" smd rect (at -1.2 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "20" smd rect (at -1.2 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "23" smd rect (at -0.4 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "24" smd rect (at -0.4 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 3664cd6c-0e81-4b8f-a3b8-87e5c0eaa82d))
(pad "25" smd rect (at 0 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp a4cda7d6-6a8e-4c70-ad55-09400ba16883))
(pad "26" smd rect (at 0 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "27" smd rect (at 0.4 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp fe10caf9-126d-4e38-84b9-5b74f894bc31))
(pad "28" smd rect (at 0.4 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp d39f88ab-4843-4548-b0bb-6db15e1d4dc6))
(pad "29" smd rect (at 0.8 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp 39ee43ad-5008-4eeb-8e0e-7f3d1943acdb))
(pad "30" smd rect (at 0.8 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp cc222e2b-894f-4351-bd17-523845927a62))
(pad "31" smd rect (at 1.2 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp ed9913c8-7a21-4eb6-a8e4-a0fae0fc6fe8))
(pad "32" smd rect (at 1.2 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "33" smd rect (at 1.6 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp ae5f10cd-a7a0-43bd-8662-5165c451a2d0))
(pad "34" smd rect (at 1.6 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp a159c6c8-347c-406e-9653-57da00f151ee))
(pad "35" smd rect (at 2 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "36" smd rect (at 2 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "40" smd rect (at 2.8 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "41" smd rect (at 3.2 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "42" smd rect (at 3.2 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "43" smd rect (at 3.6 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp b544024f-4821-4d5a-9f26-feadf25c1f79))
(pad "44" smd rect (at 3.6 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "45" smd rect (at 4 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "47" smd rect (at 4.4 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "48" smd rect (at 4.4 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "49" smd rect (at 4.8 1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "50" smd rect (at 4.8 -1.355) (size 0.23 0.66) (layers "F.Cu" "F.Paste" "F.Mask")
(thermal_bridge_angle 45) (tstamp c5718a7f-6f71-4476-83a5-6eabbb585381))
(model "/home/key/git/brayn/02_hardware/KicED/packages/811_connectors_board_to_board/10164228-0501a1rlf.stp"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

136
footprints/819_connectors_card_edge.pretty/M.2-B-KEY.kicad_mod
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@ -1,7 +1,7 @@
(module "M.2-B-KEY" (layer "F.Cu") (tedit 0) (module "M.2-B-KEY" (layer "F.Cu") (tedit 0)
(property "Sheet file" "E:/Dropbox/Eagle Projects/M.2-Templates/KiCad/M.2-Templates.sch") (property "Sheet file" "E:/Dropbox/Eagle Projects/M.2-Templates/KiCad/M.2-Templates.sch")
(property "Sheet name" "M.2-Templates_0") (property "Sheet name" "M.2-Templates_0")
(fp_text reference "U$2" (at 0 0) (layer "F.SilkS") hide (fp_text reference "REF**" (at 0 0) (layer "F.SilkS") hide
(effects (font (size 1.27 1.27) (thickness 0.15))) (effects (font (size 1.27 1.27) (thickness 0.15)))
(tstamp 0be599b7-1a60-4f44-9220-e40402ec2494) (tstamp 0be599b7-1a60-4f44-9220-e40402ec2494)
) )
@ -37,138 +37,138 @@
(fp_arc (start 10.5 -41.5) (end 11 -41.5) (angle -90) (layer "Edge.Cuts") (width 0.05) (tstamp e608254a-b347-412e-9538-788d895ae459)) (fp_arc (start 10.5 -41.5) (end 11 -41.5) (angle -90) (layer "Edge.Cuts") (width 0.05) (tstamp e608254a-b347-412e-9538-788d895ae459))
(pad "MOUNTING-HOLE" thru_hole circle (at 0 -42) (size 5.5 5.5) (drill 3.5) (layers *.Cu *.Mask) (pad "MOUNTING-HOLE" thru_hole circle (at 0 -42) (size 5.5 5.5) (drill 3.5) (layers *.Cu *.Mask)
(solder_mask_margin 0.1016) (tstamp 2f919df2-874e-4257-8062-b9de7979c7b4)) (solder_mask_margin 0.1016) (tstamp 2f919df2-874e-4257-8062-b9de7979c7b4))
(pad "P$1" smd rect (at 9.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") (pad "1" smd rect (at 9.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1016) (tstamp fc7a48fa-45c8-4c8e-8d38-bfd699fb1526)) (solder_mask_margin 0.1016) (tstamp fc7a48fa-45c8-4c8e-8d38-bfd699fb1526))
(pad "P$2" smd rect (at 9 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") (pad "2" smd rect (at 9 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 5937fd1c-5e91-4784-b3f6-df8bf182e202)) (solder_mask_margin 0.1016) (tstamp 5937fd1c-5e91-4784-b3f6-df8bf182e202))
(pad "P$3" smd rect (at 8.75 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") (pad "3" smd rect (at 8.75 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1016) (tstamp c458984b-d4d2-444f-8cbb-a8c3260982cd)) (solder_mask_margin 0.1016) (tstamp c458984b-d4d2-444f-8cbb-a8c3260982cd))
(pad "P$4" smd rect (at 8.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") (pad "4" smd rect (at 8.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 5c3e6084-2eb5-4041-b246-b784f4672106)) (solder_mask_margin 0.1016) (tstamp 5c3e6084-2eb5-4041-b246-b784f4672106))
(pad "P$5" smd rect (at 8.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") (pad "5" smd rect (at 8.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1016) (tstamp 4678fb66-828c-4b65-8cb5-43fedbc91464)) (solder_mask_margin 0.1016) (tstamp 4678fb66-828c-4b65-8cb5-43fedbc91464))
(pad "P$6" smd rect (at 8 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") (pad "6" smd rect (at 8 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 370834df-8060-4e23-909a-285a57256d16)) (solder_mask_margin 0.1016) (tstamp 370834df-8060-4e23-909a-285a57256d16))
(pad "P$7" smd rect (at 7.75 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") (pad "7" smd rect (at 7.75 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1016) (tstamp 1ad44ebb-5fa3-4053-8cee-0e2d3f81eefd)) (solder_mask_margin 0.1016) (tstamp 1ad44ebb-5fa3-4053-8cee-0e2d3f81eefd))
(pad "P$8" smd rect (at 7.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") (pad "8" smd rect (at 7.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 30b24f0a-19f6-4382-a027-d1faccff443f)) (solder_mask_margin 0.1016) (tstamp 30b24f0a-19f6-4382-a027-d1faccff443f))
(pad "P$9" smd rect (at 7.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") (pad "9" smd rect (at 7.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1016) (tstamp 79ea29b4-f551-41c0-9c5e-c779c094028d)) (solder_mask_margin 0.1016) (tstamp 79ea29b4-f551-41c0-9c5e-c779c094028d))
(pad "P$10" smd rect (at 7 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") (pad "10" smd rect (at 7 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 0283a692-14d8-4383-a194-f3399b5ac90c)) (solder_mask_margin 0.1016) (tstamp 0283a692-14d8-4383-a194-f3399b5ac90c))
(pad "P$11" smd rect (at 6.75 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") (pad "11" smd rect (at 6.75 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
(solder_mask_margin 0.1016) (tstamp 52a40164-77be-4982-9a9c-6664375151b7)) (solder_mask_margin 0.1016) (tstamp 52a40164-77be-4982-9a9c-6664375151b7))
(pad "P$20" smd rect (at 4.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") (pad "20" smd rect (at 4.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask")
(solder_mask_margin 0.1016) (tstamp 4ec50216-5402-49a6-99e5-ad56878c17c9)) (solder_mask_margin 0.1016) (tstamp 4ec50216-5402-49a6-99e5-ad56878c17c9))
(pad "P$21" smd rect (at 4.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") (pad "21" smd rect (at 4.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "P$72" smd rect (at -8.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") (pad "72" smd rect (at -8.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask")
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(pad "P$74" smd rect (at -9 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") (pad "74" smd rect (at -9 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask")
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(pad "P$75" smd rect (at -9.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") (pad "75" smd rect (at -9.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask")
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27451
packages/811_connectors_board_to_board/10164228-0501a1rlf.stp
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301
symbols/421_mcu_32_bits_stm.kicad_sym
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@ -0,0 +1,301 @@
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443
symbols/811_connector_board_to_board.kicad_sym
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@ -0,0 +1,443 @@
(kicad_symbol_lib (version 20220914) (generator kicad_symbol_editor)
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