new package 1913

master
Kerem Yollu 3 years ago
parent e30a580d34
commit a5da957f90

@ -0,0 +1,21 @@
(footprint "1913_hand_solder" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 62657617)
(attr smd)
(fp_text reference "REF**" (at 0 -5.08 unlocked) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 9d88ec4c-16ba-42ca-8cb0-a045e547e117)
)
(fp_text value "1913_hand_solder" (at 0 7.62 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a53fdea7-3617-4e29-ba39-1fc4cced14bc)
)
(fp_text user "${REFERENCE}" (at 0 10.16 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp df6a19e9-6359-4874-b780-a07aa80e9e7b)
)
(fp_line (start -0.6 -1.31) (end 0.6 -1.31) (layer "F.SilkS") (width 0.12) (tstamp 5af55f91-716b-4e7d-8c75-1fd345b7c35e))
(fp_line (start -0.6 1.31) (end 0.6 1.31) (layer "F.SilkS") (width 0.12) (tstamp b5e82878-b519-4073-ad55-f1d9914c05ff))
(pad "1" smd roundrect (at 1.65 0) (size 1.5 2.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp e2b3c6db-26a0-4a0f-91e3-f3850153add5))
(pad "2" smd roundrect (at -1.65 0) (size 1.5 2.8) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ddde8db6-e78c-400a-8a53-c5bb6cc6bdfd))
)

@ -0,0 +1,21 @@
(footprint "1913_reflow" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 62657559)
(attr smd)
(fp_text reference "REF**" (at 0 -5.08 unlocked) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 9d88ec4c-16ba-42ca-8cb0-a045e547e117)
)
(fp_text value "1913_hand_solder" (at 0 7.62 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a53fdea7-3617-4e29-ba39-1fc4cced14bc)
)
(fp_text user "${REFERENCE}" (at 0 10.16 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp df6a19e9-6359-4874-b780-a07aa80e9e7b)
)
(fp_line (start -1.6 -1.31) (end 1.6 -1.31) (layer "F.SilkS") (width 0.12) (tstamp 5af55f91-716b-4e7d-8c75-1fd345b7c35e))
(fp_line (start -1.6 1.31) (end 1.6 1.31) (layer "F.SilkS") (width 0.12) (tstamp b5e82878-b519-4073-ad55-f1d9914c05ff))
(pad "1" smd roundrect (at 1.35 0) (size 0.9 2.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp e2b3c6db-26a0-4a0f-91e3-f3850153add5))
(pad "2" smd roundrect (at -1.35 0) (size 0.9 2.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ddde8db6-e78c-400a-8a53-c5bb6cc6bdfd))
)

@ -1,6 +1,6 @@
(footprint "Phoenix_TDPT2,5_POS_3_P5,08" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 61F8013F)
(tedit 61F848A3)
(attr through_hole)
(fp_text reference "REF**" (at 6.35 -8.89 unlocked) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
@ -27,7 +27,7 @@
(pad "2" thru_hole circle (at 0 4.35) (size 2 2) (drill 1.1) (layers *.Cu *.Mask) (tstamp e98aa069-b4d7-4ef7-8631-db8798dff242))
(pad "3" thru_hole circle (at 5.3 -4.35) (size 2 2) (drill 1.1) (layers *.Cu *.Mask) (tstamp 5696b62e-f9d5-491d-b030-c9cb45f6028a))
(pad "3" thru_hole circle (at 5.3 4.35) (size 2 2) (drill 1.1) (layers *.Cu *.Mask) (tstamp 63359286-beaf-4c54-b415-0bbfefb3f9c6))
(model "${KICED_PACKAGES_DIR}/810_connectors_clable_to_Board/pxc_1017504_00_TDPT-2-5-3-SP-5-08_3D.stp"
(model "${INT_PACKAGE_DIR}/810_connectors_clable_to_Board/pxc_1017504_00_TDPT-2-5-3-SP-5-08_3D.stp"
(offset (xyz -8 -10 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))

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