From 930d319d721c319bf66436b5aa6211996a2ac8a3 Mon Sep 17 00:00:00 2001 From: kerem Date: Thu, 14 Dec 2023 17:01:35 +0100 Subject: [PATCH] Canged the m.2 connector to have correct solder mask offsets --- .../M.2-B-KEY.kicad_mod | 140 +++++++++--------- .../TE_2199230-3.kicad_mod | 138 ++++++++--------- 2 files changed, 139 insertions(+), 139 deletions(-) diff --git a/footprints/819_connectors_card_edge.pretty/M.2-B-KEY.kicad_mod b/footprints/819_connectors_card_edge.pretty/M.2-B-KEY.kicad_mod index 35a9c90..e63c9e5 100644 --- a/footprints/819_connectors_card_edge.pretty/M.2-B-KEY.kicad_mod +++ b/footprints/819_connectors_card_edge.pretty/M.2-B-KEY.kicad_mod @@ -3,11 +3,11 @@ (property "Sheet file" "E:/Dropbox/Eagle Projects/M.2-Templates/KiCad/M.2-Templates.sch") (property "Sheet name" "M.2-Templates_0") (attr through_hole) - (fp_text reference "REF**" (at 0 0) (layer "F.SilkS") hide + (fp_text reference "REF**" (at 0 5.08) (layer "F.SilkS") hide (effects (font (size 1.27 1.27) (thickness 0.15))) (tstamp 0be599b7-1a60-4f44-9220-e40402ec2494) ) - 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(solder_mask_margin 0.1016) (tstamp 9a69b5a7-d6de-43f0-b64c-1b1c2f45b7c9)) + (solder_mask_margin 0.072) (tstamp 9a69b5a7-d6de-43f0-b64c-1b1c2f45b7c9)) (pad "68" smd rect (at -7.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") - (solder_mask_margin 0.1016) (tstamp af0469dd-b0fa-4cf3-be1e-915eb1bcd519)) + (solder_mask_margin 0.072) (tstamp af0469dd-b0fa-4cf3-be1e-915eb1bcd519)) (pad "69" smd rect (at -7.75 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") - (solder_mask_margin 0.1016) (tstamp 1a8ecd9b-30f8-4c9f-bda3-3fabe02421f0)) + (solder_mask_margin 0.072) (tstamp 1a8ecd9b-30f8-4c9f-bda3-3fabe02421f0)) (pad "70" smd rect (at -8 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") - (solder_mask_margin 0.1016) (tstamp 82395127-c962-4dc5-ae19-a982c3470942)) + (solder_mask_margin 0.072) (tstamp 82395127-c962-4dc5-ae19-a982c3470942)) (pad "71" smd rect (at -8.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") - (solder_mask_margin 0.1016) (tstamp bee7346b-a23d-4c70-9640-38385eda4e3a)) + (solder_mask_margin 0.072) (tstamp bee7346b-a23d-4c70-9640-38385eda4e3a)) (pad "72" smd rect (at -8.5 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") - (solder_mask_margin 0.1016) (tstamp f3469707-8da2-4422-a478-7e2f79c56c38)) + (solder_mask_margin 0.072) (tstamp f3469707-8da2-4422-a478-7e2f79c56c38)) (pad "73" smd rect (at -8.75 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") - (solder_mask_margin 0.1016) (tstamp b8ace99e-2029-4a3c-8122-0836318d5c04)) + (solder_mask_margin 0.072) (tstamp b8ace99e-2029-4a3c-8122-0836318d5c04)) (pad "74" smd rect (at -9 -1.25) (size 0.35 2.5) (layers "B.Cu" "B.Paste" "B.Mask") - (solder_mask_margin 0.1016) (tstamp e6d9e0b9-794e-483a-a12a-cc445693cce5)) + (solder_mask_margin 0.072) (tstamp e6d9e0b9-794e-483a-a12a-cc445693cce5)) (pad "75" smd rect (at -9.25 -1.25) (size 0.35 2.5) (layers "F.Cu" "F.Paste" "F.Mask") - (solder_mask_margin 0.1016) (tstamp 7b3aad66-aea9-4275-8fb6-fa85c04b66dd)) + (solder_mask_margin 0.072) (tstamp 7b3aad66-aea9-4275-8fb6-fa85c04b66dd)) (pad "MOUNTING-HOLE" thru_hole circle (at 0 -42) (size 5.5 5.5) (drill 3.5) (layers "*.Cu" "*.Mask") - (solder_mask_margin 0.1016) (tstamp 2f919df2-874e-4257-8062-b9de7979c7b4)) + (solder_mask_margin 0.072) (tstamp 2f919df2-874e-4257-8062-b9de7979c7b4)) ) diff --git a/footprints/819_connectors_card_edge.pretty/TE_2199230-3.kicad_mod b/footprints/819_connectors_card_edge.pretty/TE_2199230-3.kicad_mod index ac73611..19d8fce 100644 --- a/footprints/819_connectors_card_edge.pretty/TE_2199230-3.kicad_mod +++ b/footprints/819_connectors_card_edge.pretty/TE_2199230-3.kicad_mod @@ -48,143 +48,143 @@ (pad "" np_thru_hole circle (at -10 0) (size 1.15 1.15) (drill 1.15) (layers "*.Cu" "*.Mask") (tstamp afc643f5-fa2c-4d77-9597-4314095a25ed)) (pad "" np_thru_hole circle (at 10 0) (size 1.65 1.65) (drill 1.65) (layers "*.Cu" "*.Mask") (tstamp 557880b3-0cf2-4cc3-9ce1-c6ec78e50b0b)) (pad "1" smd rect (at -9.25 -5.275) (size 0.3 1.55) (layers "F.Cu" "F.Paste" "F.Mask") - 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